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ETCHING METHOD FOR THIN SHEET 发明申请

2023-11-19 3100 79K 0

专利信息

申请日期 2026-04-25 申请号 JP2003321585
公开(公告)号 JP2005089783A 公开(公告)日 2005-04-07
公开国别 JP 申请人省市代码 全国
申请人 TDK CORP
简介 PROBLEM TO BE SOLVED : To provide a technique for performing a masking with a resist without breaking a brittle thin sheet containing rare-earth metal elements. SOLUTION : An adhesive sheet 11a(11b) pattern-forming as a desirable shape and loosing tacky adhesive power by heating to a prescribed temperature is stuck onto a zone as the etching objective in the thin sheet 12. Successively, the resist R in a zone as non-etching objective in the thin sheet 12 is disposed. Then, after detaching the tacky adhesive sheet 11a(11b) stuck onto the thin sheet 12 from the thin sheet 12 by heating to the prescribed temperature, the etching is applied to the thin sheet 12 disposed with the resist R. The tacky adhesive sheet 11a(11b) can be detached from the thin sheet 12 without giving excess stress in the brittle thin sheet 12 by using the tacky adhesive sheet 11a(11b) loosing the adhesion by heating the prescribed temperature as the masking with the resist R.


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