| 简介 |
PROBLEM TO BE SOLVED : To provide a high-strength wiring board comprising a thin-film wiring conductor layer, having a very small and uniform thickness and high bonding strength formed on the surface of an insulating substrate.
SOLUTION : In the wiring board comprising an insulating substrate and a thin film wiring conductor layer formed on the surface thereof, the insulating substrate is formed of a sintered body containing at least Si, Al, Mg, Ba, a rare earth element RE and O as constitutive elements, containing at least one kind selected from among forsterite crystal phase and garnite crystal phase and celsian crystal phase as a crystal phase, and having porosity not higher than 0.3%. At least a part of the celsian crystal phase is anisotropic crystal, having an aspect ratio of 3 or larger, and the thin-film wiring conductor layer contains at least one kind of conductor selected from among a group of Cu, Ag, Au and Al. |
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