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Electrolytic copper-plated R-T-B magnet and plating method thereof 发明授权

2023-10-22 1020 1352K 0

专利信息

申请日期 2025-07-05 申请号 US10070389
公开(公告)号 US6866765B2 公开(公告)日 2005-03-15
公开国别 US 申请人省市代码 全国
申请人 Setsuo Ando; Minoru Endoh; Tsutomu Nakamura; Toru Fukushi
简介 An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.


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