The epoxy resin composition for semiconductor encapsulation and semiconductor device

文件类型：PDF文档
文件大小：72K
PROBLEM TO BE SOLVED : To provide an epoxy resin composition for semiconductor encapsulation capable of suppressing generation of warpage in a package, which is easily induced by high integration achieved by a high-density assembly using a BGA (ball grid array), and a semiconductor device using the above composition.SOLUTION : The epoxy resin composition for semiconductor encapsulation comprises a glycoluril compound expressed by chemical formula (I), a curing agent, and an inorganic filler. In formula (I), Rand Rare identical or different from each other, representing H, a lower alkyl group, or a phenyl group; and Rto Rare identical or different from one another, representing H or a glycidyl group.