MEDIUM-TEMPERATURE SINTERED ALL-SILVER ELECTRODE PASTE FOR THICK FILM CIRCUIT FOR USE IN ALUMINUM AL

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A medium-temperature sintered all-silver electrode paste for a thick film circuit for use in an aluminum alloy substrate and a preparation method for the electrode paste. The electrode paste comprises an inorganic bonding phase, a spherical silver powder, a flake-like silver powder, and an organic carrier. The inorganic bonding phase consists of seven materials, namely Bi2O3, B2O3, CaO, ZnO, K2O, a nucleation agent, and a rare earth oxide. The organic carrier consists of five materials, namely an organic solvent, a macromolecular thickener, a dispersant, a defoamer, and a thixotropic agent. The preparation method for the electrode paste comprises the following process steps : a, preparation of the inorganic bonding phase; b, preparation of the organic carrier; and c, preparation of the electrode paste. The electrode paste has great thixotropy, fluidity, and a low sintering temperature; a sintered electrode layer has the advantages of being structurally smooth, dense, crack-free, pore-less, bubble-less, lead-free, and environmentally friendly; at the same time, the sintered electrode layer has the advantages of strong adhesion, wear resistance, low sheet resistance, and great printing characteristic and sintering characteristics, and greatly matches an aluminum-based insulating layer and an aluminum-based resistant paste.