Cu-Ni-Co-Si-BASED COPPER ALLOY SHEET MATERIAL, PRODUCTION METHOD, AND CONDUCTIVE MEMBER

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PROBLEM TO BE SOLVED : To provide a high-strength Cu-Ni-Co-Si-based copper alloy sheet material excellent in surface smoothness of a surface to be etched. SOLUTION : This invention relates to a copper alloy thin sheet material, having a chemical composition comprising, by mass%, total of Ni and Co : 2.50-4.00%, Co : 0.50-2.00%, Si : 0.50-1.50%, Fe : 0-0.50%, Mg : 0-0.10%, Sn : 0-0.50%, Zn : 0-0.15%, B : 0-0.10%, P : 0-0.10%, REM (rare earth element) : 0-0.10%, total content of Cr, Zr, Hf, Nb and S of 0-0.05% and the balance Cu with inevitable impurities. The copper alloy thin sheet has plate thickness of 10-60 μm and has a crystal orientation in which an integration degree of Brass orientation {011}, measured by electron back scattering diffraction, is 5.00 or more. SELECTED DRAWING : None COPYRIGHT : (C)2018, JPO&INPIT