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Al alloy sputtering target

2025-06-18 03:132170下载
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The invention relates to an Al alloy sputtering target comprising greater than 6 at.% to less than or equal to 17 at.% Cu, with the remainder comprising Al and inevitable impurities. The invention can provide an Al alloy sputtering target that contributes to an improvement in film formation rate and has excellent target manufacturability.


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