CURABLE SILICONE RESIN COMPOSITION, CURED ARTICLE THEREOF, AND OPTICAL-SEMICONDUCTOR DEVICE

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Provided is a curable silicone resin composition for forming a material (a sealant, a lens, or the like) in which an increase in the hardness thereof and a decrease in the weight thereof do not easily occur even when exposed to a harsh environment under high-temperature condition (for example, 200 ºC) for a long period of time (for example, 100 hours). The curable silicone resin composition is characterized in that a component (A), a component (B), a component (C), and a component (D), described below, are contained therein. The component (A) is a polyorganosiloxane that has, in a molecule thereof, one or more hydrosilyl group and that does not have an aliphatic unsaturated group; the component (B) is a hydrosilylation catalyst that contains a platinum-group metal; the component (C) is a branched-chain polyorganosiloxane that has one or more alkenyl group in a molecule thereof; and the component (D) is a metal salt other than a rare-earth metal salt.