A radiation-sensitive resin composition for forming a cured film, cured film, method of forming th

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PROBLEM TO BE SOLVED : To provide a resin composition for forming a cured film, which can form a cured film having excellent surface hardness and capable of fully satisfying general characteristics such as chemical resistance, heat resistance, transmittance, and dielectric constant and is excellent in storage stability.SOLUTION : The present invention is the thermosetting resin composition for forming a cured film, which contains [A] a polymer containing : a structural unit (I) containing at least one selected from the group consisting of a group represented by formula (1) and a group represented by formula (2); and a structural unit (II-1) containing a crosslinkable group (a1). In the formula (1), Rand Rare each a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 fluorinated alkyl group. In the formula (2), Rand Rare each a hydrogen atom, a halogen atom, a C1-C4 alkyl group, or a C1-C4 fluorinated alkyl group. Preferably, the crosslinkable group (a1) is at least one selected from the group consisting of an oxiranyl group and an oxetanyl group.