High dielectric constant epoxy resin composition and

文件类型：PDF文档
文件大小：104K
PROBLEM TO BE SOLVED : To provide an epoxy resin composition having excellent dielectric constant, flowability and resistance to wire sweep.SOLUTION : The epoxy resin composition includes (A) an epoxy resin, (B) a curing agent composed of a phenol resin, (C) a curing accelerator, D) a high dielectric constant powder, and (E) an inorganic filler other than the component (D). The component (A) contains a resin of general formula (1) mentioned below. In the epoxy resin composition, the component (B) is contained in such an amount that the equivalent ratio of the phenolic hydroxyl group in the component (B) is 0.5-2.0 to the epoxy group in the component (A); the component (C) is contained in an amount of 0.4-20 pts.mass to 100 pts.mass of the total amount of the A component and the B component; the D component having a specific dielectric constant higher than that of the A component is contained in an amount of 10-50 vol%; and the D component and the E component are contained in an amount of 40-90 vol% in total. In the general formula (1), X is a single bond or a group selected from CHand C(CH), and Rare each a group or atom selected from among hydrogen atom, a 1-6C linear or cyclic alkyl group, a phenyl group, and a halogen, and may be the same or different from each other.