METHOD OF ANALYSIS OF LIFETIME OF RADIO-ELECTRONIC EQUIPMENT

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FIELD : radio engineering, communication. SUBSTANCE : method of analysis of lifetime of radio-electronic equipment (REE) is based on the analysis of the strain-stress distribution and the detailed design model (DM) which includes detailed models of electric and radio products (ERP) and design elements. REE lifetime analysis is performed using thermal, deformation and strength REE DMs consistently in four stages : preparatory stage, global analysis stage, intermediate analysis stage and local analysis stage. At the preparatory stage the thermal DMs are created without detailing of models of design elements, deformation DMs with ERP detailing and the design elements effecting the structure strength, and detailed strength DMs of specific elements. At the global analysis stage REE temperatures are calculated when heat DMs are used. At the intermediate analysis stage the deformations (movements) in REE are calculated by results of REE thermal calculation at the global analysis stage, while the specific node of REE is selected using deformation DMs. Then the local analysis is performed when the strain-stress distribution of ERP and REE structural elements are calculated, on completion of calculation of the strain-stress distribution the lifetime of REE elements is calculated, for these purpose the strength DMs are used. EFFECT : reduction of temporary and computing resources spent for designing of such products, improvement of reliability of the designed products due to early detection of structure defects due to the analysis of lifetime of radio-electronic equipment and their unified electronic modules. 3 cl, 3 dwg