Large size electrostatic manufacturing method for display boards

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The present invention relates to a method for manufacturing a large-area electrostatic chuck which is used in a display substrate. The method includes : a first step of preparing a base material which is formed as a rectangular plate and is made by mixing one or more ceramic materials selected from a group including the ceramic materials such as Al_2O_3, Y_2O_3, Al_2O_3/Y_2O_3, ZrO_2, AlC, TiN, AlN, TiC, MgO, CaO, CeO_2, TiO_2, BxCy, BN, SiO_2, SiC, YAG, Mullite, and AlF_3; a second step of conducting a thermal spraying operation to spray ceramic thermal coating powder onto the outer surface of the base material at the thickness of 0.1-1 mm and processing the upper part of the base material to make the flatness rate to be in the range of 5-30 μ m; connecting a connector to the base material to supply a voltage to the base material; a fourth step of conducting a thermal coating operation to coat the ceramic thermal coating powder on top of the base material at the thickness of 0.1-1 mm to form an insulation layer; a fifth step of forming a printed layer according to a pattern set on top of the insulation layer; a sixth step of conducting a thermal coating operation to coat metal thermal coating powder on the upper part of the printed layer and the insulation layer to surround the upper part of the printed layer and the insulation layer to form a conductive electrode layer; a seventh step of removing the electrode layer formed on top of the printed layer and the printed layer; and an eighth step of forming the electrode layer on top of the insulation layer to surround the insulation layer, conducting a thermal coating operation to coat the ceramic thermal coating powder on the electrode layer at the thickness of 0.1-1 mm, and processing the upper surface to make the flatness rate to be in the range of 5-30 mm to form a dielectric layer.(S1) Step of preparing a base material(S2) Step of conducting a thermal spraying operation to spray ceramic thermal coating powder onto the outer surface of the base material at the thickness of 0.1-1 mm and processing the upper part of the base material to make the flatness rate to be in the range of 5-30 μ m(S3) Step of connecting a connector to the base material to supply a voltage to the base material(S4) Step of conducting a thermal coating operation to coat the ceramic thermal coating powder on top of the base material at the thickness of 0.1-1 mm to form an insulation layer(S5) Step of forming a printed layer according to a pattern set on top of the insulation layer(S6) Step of conducting a thermal coating operation to coat metal thermal coating powder on the upper part of the printed layer and the insulation layer to surround the upper part of the printed layer and the insulation layer to form a conductive electrode layer(S7) Step of removing the electrode layer formed on top of the printed layer and the printed layer(S8) Step of forming the electrode layer on top of the insulation layer to surround the insulation layer, conducting a thermal coating operation to coat the ceramic thermal coating powder on the electrode layer at the thickness of 0.1-1 mm, and processing the upper surface to make the flatness rate to be in the range of 5-30 mm to form a dielectric layerCOPYRIGHT KIPO 2015