Printed wiring board prepreg., laminate, printed wiring board, and the semiconductor package

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PROBLEM TO BE SOLVED : To provide an epoxy resin composition capable of providing a cured body excellent in thermal conductivity.SOLUTION : The epoxy resin composition for a laminate contains an epoxy resin, an epoxy resin curing agent, and an inorganic filler, and the epoxy resin curing agent contains a diamine represented by formula (1) wherein Rto Rare each independently a hydrogen atom, a 1-8C hydrocarbon group, a trifluoromethyl group, an aryl group or a methoxy group, and X is an amide group or the like.