SOLDER MATERIAL FOR BONDING OUTER ELECTRODE TO PIEZOELECTRIC COMPONENT, AND PIEZOELECTRIC COMPONENT

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PROBLEM TO BE SOLVED : To provide a solder material for bonding an outer electrode to a piezoelectric component, which provides a reliable and durable bond. SOLUTION : A solder material 6 for fastening an outer electrode 7 having lead wires 70 to a piezoelectric component 1, contains : tin as the main constituent; and at least one addition selected from among cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. The solder material 6 contains at least one addition selected from among silver, copper, nickel and antimony in a proportion of 0.03 to 0.17 mass%. The solder material 6 is applied onto a base metallization layer 4. The piezoelectric component 1 is comprised so that the lead wires 70 forming the outer electrode 7 are fastened to the base metallization layer 4 with the solder material 6. COPYRIGHT : (C)2015, JPO&INPIT