The condensation-curable silicone resin composition having heat resistance and optical semiconductor

文件类型：PDF文档
文件大小：215K
To provide a condensation curable silicone resin composition which has heat resistance and prevents degradation and cracks even when being left to stand at high temperature for a long period of time, as a result, when being used as an LED sealing agent, has heat resistance with less lowering of luminance of an LED, and to provide an optical semiconductor device using the same.SOLUTION : There are provided a condensation curable silicone resin composition which contains organopolysiloxane (A) having at least two hydrolyzable groups bonded to a silanol group or a silicon atom, a silane compound (B) having two or more alkoxy groups bonded to a silicon atom in one molecule, a silanol condensation catalyst (C) and a rare earth-containing organopolysiloxane compound as a heat resistance imparting agent (D); and an optical semiconductor device using the same.SELECTED DRAWING : None