Selectively molding method of electroless plating layer.

文件类型：PDF文档
文件大小：89K
PROBLEM TO BE SOLVED : To mitigate time and effort of removing dirt at a part covered with a mask; to save resources of a catalyst made of rare metal; and to obtain firm adhesion.SOLUTION : A primary molded article 1 on a hydrophobic surface is molded by injection molding of a liquid crystal polymer including a filler. A secondary molded article 3 is molded by injection molding of a mask 2 made of hydrolysable polyglycolic acid-based resin having a function of absorbing or blocking ultraviolet rays 4 so as to cover the primary molded article 1 with the mask 2 except a part 11 to be plated. The ultraviolet rays 4 are emitted to the whole surface of the secondary molded article 3 under an oxygen atmosphere, and surface modification is selectively carried out on an exposed part of the primary molded article 1. Thereafter, the mask 2 is removed by an alkali aqueous solution. The primary molded article 1 from which the mask 2 is removed is immersed in the catalyst liquid to give the catalyst 5 to a surface-modified part. Next, the primary molded article 1 is immersed in electroless copper plating liquid so as to mold an electroless plating layer 6 selectively on the surface-modified part.