LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

文件类型：PDF文档
文件大小：1292K
A lead-free, antimony-free solder alloy comprising : (a) 10 wt.% or less of silver, (b) 10 wt.% or less of bismuth, (c) 3 wt.% or less of copper, (d) at least one of the following elements up to 1 wt.% of nickel up to 1 wt.% of titanium up to 1 wt.% of cobalt up to 3.5 wt.% of indium up to 1 wt.% of zinc up to 1 wt.% of arsenic, (e) optionally one or more of the following elements 0 to 1 wt.% of manganese, 0 to 1 wt. % of chromium, 0 to 1 wt.% of germanium, 0 to 1 wt.% of iron, 0 to 1 wt.% of aluminum, 0 to 1 wt.% of phosphorus, 0 to 1 wt.% of gold, 0 to 1 wt.% of gallium, 0 to 1 wt.% of tellurium, 0 to 1 wt.% 20 of selenium, 0 to 1 wt.% of calcium, 0 to 1 wt.% of vanadium, 0 to 1 wt.% of molybdenum, 0 to 1 wt.% of platinum, 0 to 1 wt.% of magnesium, 0 to 1 wt.% of rare earths, (f) the balance tin, together with any unavoidable 2 impurities.