SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE, AND METHOD F

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This substrate (10) for a power module is provided with an insulating substrate (11) and a circuit layer (12) formed on one surface of the insulating substrate (11). The circuit layer (12) is configured by bonding a first copper plate (22) onto one surface of the insulating substrate (11). Before being bonded, the first copper plate (22) has a composition containing at least : a total of 1 molppm to 100 molppm of one or more of an alkali earth metal, a transition metal element, and a rare earth element; or 100 molppm to 1000 molppm of boron; with the remainder being copper and unavoidable impurities.