ELECTROLESS PALLADIUM PLATING SOLUTION

文件类型：PDF文档
文件大小：70K
PROBLEM TO BE SOLVED : To provide an electroless palladium plating solution that makes it possible to obtain a Pd plating coat constituting a plating coat having excellent wire bonding properties even after a thermal hysteresis. SOLUTION : An electroless palladium plating solution has a palladium compound, a reductant, a complexing agent, and at least one selected from the group consisting of Ge and rare earth elements. SELECTED DRAWING : None COPYRIGHT : (C)2019, JPO&INPIT