WIRING FILM AND ELECTRODE USING Ti ALLOY BARRIER METAL AND Ti ALLOY SPUTTERING TARGET

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PROBLEM TO BE SOLVED : To provide a novel wiring film having a characteristic of excellent wet etching processability. SOLUTION : A wiring film to be used in a display device or a touch panel sensor, comprises a layered structure of two or more layers including a Ti alloy layer containing 3 to 50 atm.% of an element of a group X (where, the group X is composed of at least one element selected from the group consisting of a rare earth element, Ge, Si, Sn, Hf, Zr, Mg, Ca, Sr, Al, Zn, Mn, Co, Fe and Ni) and/or 0.2 to 3.0 mass% of oxygen as an alloy component, and a balance of Ti and inevitable impurities; and a layer of pure Cu or a Cu alloy. COPYRIGHT : (C)2013, JPO&INPIT