METHOD FOR FORMING ELECTRIC COPPER PLATING FILM ON SURFACE OF RARE EARTH PERMANENT MAGNET

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In order to address the problem of providing a novel method for forming an electric copper plating film with excellent adhesion on the surface of a rare earth permanent magnet, the method of the present invention is characterized by the immersion of a magnet in plating solution, followed by the application of 0.05A/dm2-4.0A/dm2 as the cathode current density for electric copper plating for 10-180 s, to commence processing.