ULTRAVIOLET CURABLE SILICONE RESIN COMPOSITION HAVING HEAT RESISTANCE, AND OPTICAL SEMICONDUCTOR DE

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To provide an ultraviolet curable silicone resin composition which has heat resistance and prevents degradation and cracks even when being left to stand at high temperature for a long period of time, as a result, when being used as an LED sealing agent, has heat resistance with less lowering of luminance of an LED, and to provide an optical semiconductor device using the same.SOLUTION : There are provided an ultraviolet curable silicone resin composition which contains organovinyl polysiloxane (A) having at least two silicon bond alkenyl groups reacting with an SiH group in one molecule, organo hydrogen polysiloxane (B) having at least two SiH groups in one molecule, a photoactive type hydrosilylation reaction catalyst (C) and a rare earth-containing organopolysiloxane compound as a heat resistance imparting agent (D); and an optical semiconductor device using the same.SELECTED DRAWING : None