CERAMIC SINTERED COMPACT, HEAT DISSIPATING SUBSTRATE AND ELECTRONIC DEVICE

文件类型：PDF文档
文件大小：439K
PROBLEM TO BE SOLVED : To solve such the problem that the demand of reliability on insulation performance is not necessarily sufficient because higher reliability is required nowadays although a conventional ceramic circuit substrate has superior heat resistant cycle characteristics and bending strength characteristics.SOLUTION : A ceramic sintered compact is characterized by including a main ingredient of silicon nitride and a grain boundary phase containing a rare earth metal oxide and by the number of the grain boundary phases in the range of an area at an optional cross section of 100 μm2 being 42.COPYRIGHT : (C)2011, JPO&INPIT