PLATING METHOD AND APPARATUS

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PROBLEM TO BE SOLVED : To provide a plating method by which plating undeposition does not occur and a step for electrode replacement is reduced even in alignment electroplating causing no lead bending or hit mark on an electronic component. SOLUTION : Wire-like electrodes 1 and contact assist wires 2 moving in parallel and opposed to the direction substantially intersecting an earth lead 18 and an insulating lead wire of headers 10 aligned on an alignment plate 19 at a right angle, are arranged. Since the wire like electrodes 1, insulating leads 16 and earth leads 18 are brought into contact with each other through a noncontact state, the contact does not converge and the plating undeposition does not occur and by supplying peeling current in the noncontact state, the deposition of a plating composition in the wire like electrode 1 is prevented. COPYRIGHT : (C)2008, JPO&INPIT