CERAMIC COMPOUND COMPOSITION FOR CONDUCTIVE PASTE, AND CONDUCTIVE PASTE AND LAMINATED CERAMIC ELECT

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PURPOSE : A composition of preform for a conductive paste, and a conductive paste and a laminated ceramic electronic part using the same, and a method of manufacturing a laminated ceramic electronic part are provided to optimize manufacturing conditions of electronic parts by using a characteristic that the content of Ba controls a rapid shrinkage of the preform at a low temperature side, and the diameter of the preform controls the shrinkage of a high temperature side. CONSTITUTION : A ceramic powder includes the compound of Re having 0.2 to 3.0 mole %%, the compound of Mg having 0.2 to 3.0 mole %%, the compound of Mn having 0.05 to 0.5 mole %%, the compound of Ba or the compound of Ca having 1.0 to 6.0 mole %% with respect to ABO_3 powder of 100 mole %%. A corresponds to Ba or Ba having a portion of Ba substituted for one of Ca and Sr. B corresponds to Ti or Ti having a portion of Ti substituted for one of Zr and Hf. Re corresponds to one of rare earth elements. © KIPO 2006