FAST HEATING AND COOLING WAFER HANDLING ASSEMBLY AND METHOD OF MANUFACTURING THEREOF

文件类型：PDF文档
文件大小：332K
PURPOSE : An apparatus for a semiconductor process chamber is provided to process a plurality of semiconductor wafer substrates by making a wafer process assembly include a cassette having a plurality of heating plates. CONSTITUTION : A heater/holder assembly has at least one resistor heating element for heating at least one material having various sizes and an initial temperature to a target temperature higher than the initial temperature by at least 50 deg.C. At least one vertically-transferable shaft(66) supports the assembly, coupled to the heating element in a manner that the heating element is increased or decreased to generate a non-contact gap of around 0.5-10 millimeters between the heating element and the material. The heating element is patterned to be a plurality of circuits for forming at least one area for individually controlling and heating the at least one material having various sizes on a platform. At least a part of the surface of the heating element is coated with an element selected from a group of B, Al, Si, Ga, refractory hard metal, transition metal and rare earth metal, or a composition thereof and/or a dielectric insulation coating layer made of at least one of nitride, carbide, carbon nitride and oxynitride of the composition. The heating element has at least a temperature ramp rate of 1 deg.C per second so that the material is heated from the initial temperature to the target temperature. © KIPO 2006