Purifying wire from a Gold-Legierung, procedure for its production and its use

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FINE WIRES OF A GOLD ALLOY CONTAINING 0.5 TO 0.9 W% OF COPPER AND SMALL PROPORTIONS OF PLATINUM OR AT LEAST ONE ELEMENT FROM THE GROUP OF ALKALINE EARTH METAAL AND RARE EARTH METALS ARE CHARACTERIZED BY A SPECIFIC ELECTRICAL RESISTANCE SIMILAR TO THAT OF GOLD AND A FAVORABLE STRENGTH-TO-ELONGATION RATIO. THEY ARE SUITABLE BOTH FOR WIRE BONDING AND FOR MAKING THE BALL BUMPS OF FLIP CHIPS.