Metal surface treatment liquid, structure, and method for manufacturing the wiring structure

文件类型：PDF文档
文件大小：1833K
PROBLEM TO BE SOLVED : To provide a metal surface treatment solution, etc., capable of improving adhesion between a metal wiring or a barrier layer and an insulation layer.SOLUTION : The metal surface treatment solution comprises a first liquid including a compound represented by the general formula (1) and a second liquid including a compound represented by the general formula (2). (Rand Rare independently a substituted/unsubstituted C1-3 alkyl group or a substituted/unsubstituted phenyl group; respectively; Ris an C1-3 alkyl group; Ris an amino group, a mercapto group, a glycidyl group, a glycidoxy group, an alicyclic epoxy group, an imidazole group, an isocyanate group, an ureido group, a vinyl group, a methacryloxy group, an acryloxy group, a styryl group or a substituted amino group; m is an integer of 0-5; and n is an integer of 1-2.)SELECTED DRAWING : None