文件类型:PDF文档
文件大小:1540K
To provide a sputtering target which allows suppression of contamination of a fluorine element being an impurity in the sputtering target, suppression of generation of an abnormal discharge due to fluorine when a thin film is formed by using the sputtering target, and formation of a thin film having a good orientation.SOLUTION : A sputtering target includes aluminum, and one or both of a rare earth element and a titanium group element. The content of fluorine is 100 ppm or less.SELECTED DRAWING : Figure 1