ALLOY SOLDER, AND PREPARATION METHOD THEREFOR AND USE THEREOF

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Provided is a low-temperature alloy solder, comprising, in parts by weight : 17-35 parts of tin, 20-45 parts of lead, 20-40 parts of bismuth, 0.1-2 parts of indium, 0.1-0.5 parts of antimony, 0.01-0.2 parts of phosphorus and 0.01-0.8 parts of a rare earth element. The alloy solder takes a tin-lead-bismuth three-phase alloy as a main component, has a melting point lower than 145°C, is suitable for a laminating process of a photovoltaic module, and realizes the integration of the welding process and the laminating process of a main-grid-free battery. Further disclosed is a preparation method for the alloy solder and a use thereof.