Curable resin composition and electronic device

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PROBLEM TO BE SOLVED : To provide a curable resin composition excellent in both heat resistance after curing and moldability.SOLUTION : The curable resin composition contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) a maleimide compound. The curing accelerator (C) contains a compound represented by a general formula (I-1). (In the formula (I-1), Rto Rare each independently a C1-C18 hydrocarbon group; at least one of Rto Ris a C1-C18 aliphatic hydrocarbon group; two or more of Rto Rmay be bonded to each other to form a cyclic structure; Rto Rare each independently a hydrogen atom, a hydroxyl group, or a C1-C18 organic group; and two or more of Rto Rmay be bonded to each other to form a cyclic structure.)