CLAD MATERIALS FOR HERMETIC SEALING OF ELECTRONIC COMPONENTS AND METHOD FOR THE MANUFACTURE THEREOF

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The problem addressed by the present invention is to provide : a cladding member that is for the airtight sealing of an electronic component, comprises Kovar and a silver-based brazing material, and has superior punching workability. At the surface of a Kovar layer, the fraction of the surface area that is an austenite phase within the total surface area of the Kovar crystal grains as calculated from a crystal phase distribution measurement by means of an electron beam backscattering diffraction method is 99.0-100.0%, and the average crystal grain size of the Kovar crystal grains is 0.5-3.5 μm.