Curable resin composition, cured, and printed circuit board

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PROBLEM TO BE SOLVED : To provide a curable composition from which a cured product having excellent heat resistance and a low thermal expansion coefficient and exhibiting little change in heat resistance after a thermal history is obtained, and to provide a cured product obtained by curing the same and a printed wiring board.SOLUTION : The curable resin composition contains an epoxy resin (A) and a phenol resin (B). The epoxy resin (A) has a molecular structure which has a polyaryleneoxy structure as a main skeleton and in which a glycidyloxy group or a methylglycidyloxy group and a structural moiety (α) represented by structural formula (1) [In the formula (1), Rand Rare each independently a methyl group or a hydrogen atom; Ar is a phenylene group, a phenylene group nuclear-substituted with one to three C1-C4 alkyl groups, a naphthylene group, or a naphthylene group nuclear-substituted with one to three C1-C4 alkyl groups; and n as the average number of repetitions is 0.1-4.] are bonded to an aromatic ring of the polyaryleneoxy structure.